|Application||In Electronics, Heat Sink Compound is Used to Thermally Bond a Component and a Mechanical Heat Sink, Efficient Cooling||Mfg Part Number||1978-DP|
|Item||Silicone-Free Heat Sink Compound||Size||4 oz.|
- Item # 19YY66
- Mfr. Model # 1978-DP
- UNSPSC # 32131001
- Catalog Page # N/A
- Shipping Weight 0.26 lbs.
|VMRS (ATA) CODES||053-999-058||Silicone- Free Heat|
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