4 oz. Silicone-Free Heat Sink Compound
With the ability to draw heat away when applied to a component, this TECHSPRAY silicone-free heat sink compound is generally used to thermally bond a component with a mechanical heat sink. Suitable for use in a variety of electrical applications including use with calrods, thermistors, and thermocouple wells. This easy-to-apply material is non-ozone depleting and it won’t separate, harden, or crack.
Compliance & RestrictionsSafety Data Sheet (SDS) View
|Grainger Dropship||19YY66||Silicone- Free Heat|
|VMRS (ATA) CODES||053-999-058||Silicone- Free Heat|
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